MediaTek Dimensity 8200 chip launched for premium 5G smartphones
MediaTek has unveiled a new Dimensity 8200 chip which has been specifically designed for premium 5G smartphones.
Smartphones powered by the new MediaTek Dimensity 8200 chipset will offer flagship-level experiences such as connectivity, gaming, multimedia, displays, and imaging, the company said in a statement.
It also comes equipped with an octa-core central processing unit (CPU) with four Arm Cortex-A78 cores operating at up to 3.1 GHz, along with a powerful Mali-G610 graphics engine, for better performance across applications.
The chipset makes use of MediaTek's HyperEngine 6.0 gaming technology to improve gaming performance so users can experience smooth high framerate games without experiencing connection drops, FPS jitter, or gameplay hiccups.
Our latest launch, #MediaTekDimensity8200, upgrades gaming experience on premium #5Gsmartphones with supreme performance & incomparable power efficiency. The 4nm Dimensity 8200 also powers cutting-edge display, connectivity, & picture quality features. https://t.co/GzDjNwN8eX pic.twitter.com/99SuWqT4y5
— MediaTek (@MediaTek) December 8, 2022
Smoother viewing experiences are made possible by MediaTek's Intelligent Display Sync 2.0 technology, which automatically adjusts the display refresh rate in accordance with the game frame rate.
“The MediaTek Dimensity 8200 will enhance the gaming experience on premium 5G smartphones, and will deliver smoother gameplay with higher framerates, impressive graphics, and seamless connectivity,” said CH Chen, Deputy General Manager, MediaTek's Wireless Communications Business Unit.
“Plus, the Dimensity 8200's power efficiency enhancements make it so consumers don't have to sacrifice battery life to enjoy super high performance,” Chen added.
Powered by a flagship-level Imagiq 785 ISP, the Dimensity 8200 is capable of supporting 320MP photos and capturing 14-bit HDR video on up to three cameras simultaneously, and recording cinematic video by double camera. The chipset also has exceptionally fast AI-noise reduction to retain fine details, particularly in low-light environments.
The fully integrated 5G modem in the Dimensity 8200 features the 3GPP Release-16 standard technology and 3CC carrier aggregation to amplify sub-6GHz performance. The chipset also supports tri-band Wi-Fi 6E for faster wireless connectivity, while the 2×2 antenna ensures improved performance and connection reliability.
Additional features of the Dimensity 8200 include:
- Powerful AI processing unit to maximize the efficiency of dedicated AI tasks and fusion processing.
- Ultra-efficient Vulkan SDK to provide faster and more effective ray tracing effects.
- Support for brilliant 120Hz WQHD+ and 180Hz Full HD+ displays.
- Immersive viewing experiences with HDR10+ Adaptive support, 4K AV1 media decoding, and AI SDR-to-HDR video playback.
- Incredible audio quality with Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio.
MediaTek said that this new chip will power 5G devices launching in the global market starting in December 2022.